Preceding Plate Automatic Peeling Device MGU-500
Handled by M.C.K. Corporation,
This is an introduction to the automatic peeling device for the leading board.
- Company：エム・シー・ケー 東京 電子事業本部
- Price：Other
Automatic Peeling Device - List of Manufacturers, Suppliers, Companies and Products
Automatic Peeling Device Product List
1～3 item / All 3 items
Displayed results
Automatic peeling device for protective film for printed circuit boards.
By automating the peeling process of various protective films for inline-produced package substrates and automotive substrates, it is possible to reduce labor and improve productivity.
【Product Features】 ○ Clean Release By eliminating the use of air blow, chip flying can be reduced to create a release trigger. ○ No Setup Required No need for setup changes based on the thickness and size of the substrate. ○ Compatible with Ultra-Thin Substrates (Material Thickness: 0.025mm) Equipped with substrate clamps, it can handle ultra-thin plates that were difficult to release with conventional equipment. ○ Compatible with Difficult-to-Release Materials Please consult us regarding difficult-to-release materials such as ABF for PKG substrates and solder resist. ○ Built-in NG Stocker Film remnants are automatically detected by sensors and stored in the NG stocker. ○ Clean Specification Support (Additional Option) Downflow using HEPA filters is also possible. We can conduct release tests with demo machines and consider special support for thin substrates, large substrates, and special films, so please feel free to contact us.
- Company：アドテックエンジニアリング
- Price：Other
Wafer automatic peeling device (peeling and cleaning machine)
PHT will operate globally as a niche top company in the semiconductor industry, specializing in wafer automatic peeling devices (peeling and cleaning machines).
This is an automatic wafer detaching device after wire sawing (slicing). By setting the ingot adhered to the plate jig on the input side, the system performs everything from rough cleaning to wafer detachment, wafer single-sheet cleaning, drying, and cassette storage automatically. The plate jig after detachment is discharged to the unloader side. Detachment is done using a hot air heating method, one piece at a time. The wafers after detachment undergo single-sheet cleaning. After high-pressure cleaning with two fluids, scrub cleaning, rinse cleaning, and drying with suction rollers, they are stored one by one in the cassette at the unloader section using a horizontal multi-joint robot. Storage can be selected from the upper or lower section of the cassette (which holds 25 pieces). A maximum of 6 storage cassettes can be accommodated. It is compatible with OHT transport.
- Company：PHT
- Price：Other
